• PF30H SMD high voltage diode 30KV, 200mA, 75nS
  • CL04-30 Low Frequency High voltage diode 30KV 200mA
  • CL04-30 Low Frequency High voltage diode 30KV 200mA
  • PF30H SMD high voltage diode 30KV, 200mA, 75nS
  • CL04-30 Low Frequency High voltage diode 30KV 200mA
  • CL04-30 Low Frequency High voltage diode 30KV 200mA

CL04-12 Low Frequency High voltage diode 12KV 500mA

No.CL04-12
Products Main features:
1、Axial leaded connection.
2、High thermal conductivity epoxy compound molding.
3、Quick connect terminals can be installed.
4、Special high temperature resistant chip protective glue.
5、Excellent discharge characteristics.
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  • PF30H SMD high voltage diode 30KV, 200mA, 75nS
  • CL04-30 Low Frequency High voltage diode 30KV 200mA
  • CL04-30 Low Frequency High voltage diode 30KV 200mA
  • Desciption
  • Discharge problem
CL04-12 Low Frequency High voltage diode Data Sheet
 Parameter Symbol Unit Test Conditions Value
 Repetitive Peak Backward Voltage Vrrm KV Ta=25℃  Ir=2.0μA 12
 Peak Working Backward Voltage Vrwm KV Ta=25℃  Ir=2.0μA 12
 Average Forward Current If(AV) mA 50Hz Half-sine Wave , Resistance load @Tbreak=50℃ 500
 Backward Recovery Time Trr nS   --
 Surge Forward Current Ifsm A 0.01S @ Half-Sine wave  50Hz 30
 Junction Temperature(MAX) Ta   -40~+150
 Storage Temperature Tstg   -40~+125
 Forward Peak Voltage Vfm V   ≥12.0
 Backward Peak  Current Irrm1 μA @ Ta=25℃ VRM=VRRM 2
Irrm2 μA @ Ta=100℃ VRM=VRRM 20.0
 Absolute Maximum Ratings & Electrical Characteristics
The selection of high-voltage diodes is closely related to their usage environment。

1. Used in insulating oil. (Recommended)
2. Used in insulating gases. (Recommended)
3. Secondary packaging use. (High requirements for heat dissipation and other parameter performance of components)
4. Use in exposed air or add air cooling. (If the size of the high-voltage diode is small, it is easy to discharge, and the heat dissipation performance is average.)

For high-voltage diodes used in exposed air, it is recommended to install them with insulated electrodes at both ends.




Common treatment methods for surface adhesive insulation:

Characteristics of insulation adhesive material:

1. Silicone material usually presents a transparent and elastic rubber state after curing, which is more effective in shock resistance and can also withstand severe stress changes caused by large high and low temperature changes (-40 ° C~200 ° C).

2. Acrylic materials typically exhibit a transparent and hard coating after curing, with low moisture absorption and fast curing time, as well as excellent wear resistance and insulation.

3. After curing, Urethane material usually presents a transparent and hard coating, which has superior wear resistance and good moisture resistance. Its performance is particularly stable in low temperature environments, but it is less resistant to high temperatures.

4. The coating material based on epoxy is very sturdy and usually opaque, with good moisture and moisture resistance. Its resistance to chemical corrosion and wear is also very good. In addition, epoxy also has good dielectric properties.

Here, suitable insulation adhesive materials can be selected based on the different usage situations of engineers.

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